Flow&Parameters
6 SMT lines,Fuji XPF, NXT3, Fully automatic solder paste printing machine, Ten temperature zone reflow oven, AOI, SPI and other equipment, SMD production capacity 6 million Solder joints / day, Good at high precision, high complexity PCB.
SMT Production capacity 6 million Solder joints/day SMT LINE 6 line drop materials rate 1、Resistance and capacitance0.3% 2.IC, no drops Board types POP/FR4/FPC/Rigid-flex board/Metal substrate SMT component specifications The smallest package 03015 Chip/0.35 Pitch BGA Minimum device accuracy ±0.04mm IC chip mounting accuracy ±0.03mm PCB mounting size specifications PCB size 50*50mm - 686*508mm PCB thickness 0.3-6.5mm
SMT Cases
| Item | Details |
 | Item：High-precision SMT Field of application:Optical signal transmission Density of pads：High SMT：0402(Smallest size) Chip density：High BGA quantity : 2PCS BGA density：0.8mm（Smallest density） Board thickness：2.5mm Material types：122 kinds |
 | Item：High-precision SMT Field of application:：Optical signal transmission Density of pads：High SMT：0402(Smallest size) Chip density：High BGA quantity:2PCS BGA density：0.8mm（Smallest density） Board thickness：2.5mm Material types：122 sorts |
 | Item：High-precision SMT Field of application:：HD video processing Board Density of pads：medium SMT：0402(Smallest size) Chip density：High BGA quantity：4PCS BGA density：0.5mm（Smallest density） Board thickness：2.0mm Material types：76 sorts |
 | Item：High-density DSP signal core board mounting Field of application:：High-speed DSP signal processing core board Density of pads：High SMT：0402(Smallest size) Chip density：High BGA quantity：5PCS BGA density：0.6mm（Smallest density） Board thickness：2.0mm Material types：96 sorts |
