6 SMT lines,Fuji XPF, NXT3, Fully automatic solder paste printing machine, Ten temperature zone reflow oven, AOI, SPI and other equipment, SMD production capacity 6 million Solder joints / day, Good at high precision, high complexity PCB.
SMT Production capacity 6 million Solder joints/day SMT LINE 6 line drop materials rate 1、Resistance and capacitance0.3% 2.IC, no drops Board types POP/FR4/FPC/Rigid-flex board/Metal substrate SMT component specifications The smallest package 03015 Chip/0.35 Pitch BGA Minimum device accuracy ±0.04mm IC chip mounting accuracy ±0.03mm PCB mounting size specifications PCB size 50*50mm - 686*508mm PCB thickness 0.3-6.5mm
SMT Cases
Item | Details |
![]() | Item:High-precision SMT Field of application:Optical signal transmission Density of pads:High SMT:0402(Smallest size) Chip density:High BGA quantity : 2PCS BGA density:0.8mm(Smallest density) Board thickness:2.5mm Material types:122 kinds |
![]() | Item:High-precision SMT Field of application::Optical signal transmission Density of pads:High SMT:0402(Smallest size) Chip density:High BGA quantity:2PCS BGA density:0.8mm(Smallest density) Board thickness:2.5mm Material types:122 sorts |
![]() | Item:High-precision SMT Field of application::HD video processing Board Density of pads:medium SMT:0402(Smallest size) Chip density:High BGA quantity:4PCS BGA density:0.5mm(Smallest density) Board thickness:2.0mm Material types:76 sorts |
![]() | Item:High-density DSP signal core board mounting Field of application::High-speed DSP signal processing core board Density of pads:High SMT:0402(Smallest size) Chip density:High BGA quantity:5PCS BGA density:0.6mm(Smallest density) Board thickness:2.0mm Material types:96 sorts |